Customization: | Available |
---|---|
Application: | Computer, Electronic, Automobile, RF, Home Appliance, Motorcycle |
Wire Core Material: | Copper Wire |
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PCB custom capacity
Item | Mass Production | Pilot Run Production |
Capacity | Capacity | |
Layer Counts | 1L-18L, HDI | 20-28 , HDI |
Material | CEM1,CEM3,FR-4, High TG FR4 , Halogen-free FR4 , aluminium ,Ceramic(96% Alumina) | |
PTFE(F4B,F4BK), Rogers(4003,4350,5880)Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc. | ||
Material Mixed Laminate | 4 layers -- 10 layers | 12 layers |
FR4+Ro4350 , FR4+Aluminium , FR4+ Polyimide | ||
Maximum Size | 610mm X 1200mm | 1200 - 2000MM |
Board Outline Tolerance | ±0.15mm | ±0.10mm |
Board Thickness | 0.125mm--6.00mm | 0.1mm--8.00mm |
Thickness Tolerance ( t≥0.8mm) | ± 8% | ±5% |
Thickness Tolerance( t<0.8mm) | ±10% | ±8% |
Minimum Line / Space | 0.10mm | 0.075mm |
Trace width Tolerance | 15%-20% | 10% |
Minimum Drilling Hole (Mechanical) | 0.2mm | 0.15mm |
Minimum laser hole | 0.1mm | 0.075mm |
Hole Position/hole Tolerance | ±0.05mm PTH:±0.076MM NPTH:±0.05mm | |
Mini hole ring (single | 0.075MM | 0.05MM |
OutLayer Copper Thickness | 17um--175um | 175um--210um |
InnerLayer Copper Thickness | 17um--175um | 175um--210um |
Mini Solder Mask Bridge | 0.05mm | 0.025mm |
Impedance Control Tolerance | ±10% | ±5% |
Surface Finishing | HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver. | |
Plated gold , OSP, Carbon ink, | ||
Acceptable File Format | ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc. | |
Quality Standards | IPC-A-600F and MIL-STD-105D CHINA GB<4588> |
PCBA custom Capacity
Stencil Size |
736x736mm |
Minimum IC Pitch | 0.2mm |
Maximum PCB size | 510X460mm |
Minimum PCB thickness | 0.5mm |
Minimum chip size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
Maximum BGA size: | 74x74mm |
BGA ball pitch: | 1.00mm (minimum), 3.00mm (maximum) |
BGA ball diameter: | 0.40mm (minimum), 1.00mm (maximum) |
QFP lead pitch: | 0.38mm (minimum), 2.54mm (maximum) |
Machine Type | Panasonic CM 402 |
Panasonic DT301 | |
Panasonic CM 402 | patch speed:0.06sec/ chip (up to 60,000cph) |
Patch precision:±0.03~±0.005mm | |
PCB size:max:510X460mm,min:50X50mm | |
element size: 0603mm-50X50mm | |
Panasonic DT301 | patch speed:0.7sec/ chip |
Patch precision:±0.03~±0.005mm | |
PCB size:max:510X460mm,min:50X50mm | |
element size: 1005mm-100X90mmX25mm high speed multifunctional mounter | |
Volume: | One piece to low volume production quantities |
Low cost first prototype Fab | |
Fast deliveries | |
Assembly type: | SMT assembly |
DIP assembly | |
Mixed(surface mount and through hole) technology | |
Cable assembly | |
Components type: | Passive components |
As small as 0402 package | |
As small as 0201 with design review | |
Ball Grid Arrays(BGA): | |
As small as .5mm pitch | |
Component source | Shar,poshiba, ST, |
Samsung, Infineon, Ti, | |
ON,Microchip etc. | |
Parts procurements: | provide one-stop services |
Only Assembly service (you supply the parts) | |
You supply some parts(expensive/important components), we do the rest | |
Solder type: | Leaded |
Lead-free/ROHS compliant | |
Other capabilities: | Repair/rework services |
Mechanical assembly | |
Box build | |
Mold and plastic injection. | |
Testing Type | First prototype test before mass quantity production |
AOI | |
BGA X-ray | |
PCB E-test | |
Lead time | According Digikey components delivery time |