| Customization: | Available |
|---|---|
| Application: | Computer, Electronic, Automobile, RF, Home Appliance, Motorcycle |
| Wire Core Material: | Copper Wire |
|
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1. Adopting 18AWG, flame retardant, resistant to low temperature of -40 degrees Celsius and high temperature of 120 degrees Celsius,
2. PD compatible power bank: Use Starlink mini cable with PD compatible power supply to provide stable power for Starlink mini dish antenna. For optimal performance and long-term reliability, please choose a portable power bank with an output power of at least 100 watts. Attention: The power bank must support PD (Power Delivery) protocol.
3.Compatibility and portability: The Starlink mini power cord is designed specifically for the Starlink Mini dish antenna. It adopts direct USB-C connection, achieving seamless compatibility and stability. The compact and portable design makes it easy to carry and use.
4.Efficiency and reliability: The Starlink DC power cord is made of high-quality materials for stable and reliable power transmission, protecting the Starlink Mini antenna from damage or performance issues caused by power fluctuations.
5.Plug and play: Starlink power cord, easy to install. Simply plug it into the USB-C port for immediate power supply, without the need for an additional adapter. This is a perfect Starlink mini accessory suitable for non-technical users.
6.The Starlink DC to USB-C power cord is waterproof and versatile, eliminating the need to worry about harsh weather conditions. It is not only very suitable for Starlink mini antennas, but also compatible with other USB-C devices.
PCB custom capacity
| Item | Mass Production | Pilot Run Production |
| Capacity | Capacity | |
| Layer Counts | 1L-18L, HDI | 20-28 , HDI |
| Material | CEM1,CEM3,FR-4, High TG FR4 , Halogen-free FR4 , aluminium ,Ceramic(96% Alumina) | |
| PTFE(F4B,F4BK), Rogers(4003,4350,5880)Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc. | ||
| Material Mixed Laminate | 4 layers -- 10 layers | 12 layers |
| FR4+Ro4350 , FR4+Aluminium , FR4+ Polyimide | ||
| Maximum Size | 610mm X 1200mm | 1200 - 2000MM |
| Board Outline Tolerance | ±0.15mm | ±0.10mm |
| Board Thickness | 0.125mm--6.00mm | 0.1mm--8.00mm |
| Thickness Tolerance ( t≥0.8mm) | ± 8% | ±5% |
| Thickness Tolerance( t<0.8mm) | ±10% | ±8% |
| Minimum Line / Space | 0.10mm | 0.075mm |
| Trace width Tolerance | 15%-20% | 10% |
| Minimum Drilling Hole (Mechanical) | 0.2mm | 0.15mm |
| Minimum laser hole | 0.1mm | 0.075mm |
| Hole Position/hole Tolerance | ±0.05mm PTH:±0.076MM NPTH:±0.05mm | |
| Mini hole ring (single | 0.075MM | 0.05MM |
| OutLayer Copper Thickness | 17um--175um | 175um--210um |
| InnerLayer Copper Thickness | 17um--175um | 175um--210um |
| Mini Solder Mask Bridge | 0.05mm | 0.025mm |
| Impedance Control Tolerance | ±10% | ±5% |
| Surface Finishing | HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver. | |
| Plated gold , OSP, Carbon ink, | ||
| Acceptable File Format | ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc. | |
| Quality Standards | IPC-A-600F and MIL-STD-105D CHINA GB<4588> | |
PCBA custom Capacity
|
Stencil Size |
736x736mm |
| Minimum IC Pitch | 0.2mm |
| Maximum PCB size | 510X460mm |
| Minimum PCB thickness | 0.5mm |
| Minimum chip size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
| Maximum BGA size: | 74x74mm |
| BGA ball pitch: | 1.00mm (minimum), 3.00mm (maximum) |
| BGA ball diameter: | 0.40mm (minimum), 1.00mm (maximum) |
| QFP lead pitch: | 0.38mm (minimum), 2.54mm (maximum) |
| Machine Type | Panasonic CM 402 |
| Panasonic DT301 | |
| Panasonic CM 402 | patch speed:0.06sec/ chip (up to 60,000cph) |
| Patch precision:±0.03~±0.005mm | |
| PCB size:max:510X460mm,min:50X50mm | |
| element size: 0603mm-50X50mm | |
| Panasonic DT301 | patch speed:0.7sec/ chip |
| Patch precision:±0.03~±0.005mm | |
| PCB size:max:510X460mm,min:50X50mm | |
| element size: 1005mm-100X90mmX25mm high speed multifunctional mounter | |
| Volume: | One piece to low volume production quantities |
| Low cost first prototype Fab | |
| Fast deliveries | |
| Assembly type: | SMT assembly |
| DIP assembly | |
| Mixed(surface mount and through hole) technology | |
| Cable assembly | |
| Components type: | Passive components |
| As small as 0402 package | |
| As small as 0201 with design review | |
| Ball Grid Arrays(BGA): | |
| As small as .5mm pitch | |
| Component source | Shar,poshiba, ST, |
| Samsung, Infineon, Ti, | |
| ON,Microchip etc. | |
| Parts procurements: | provide one-stop services |
| Only Assembly service (you supply the parts) | |
| You supply some parts(expensive/important components), we do the rest | |
| Solder type: | Leaded |
| Lead-free/ROHS compliant | |
| Other capabilities: | Repair/rework services |
| Mechanical assembly | |
| Box build | |
| Mold and plastic injection. | |
| Testing Type | First prototype test before mass quantity production |
| AOI | |
| BGA X-ray | |
| PCB E-test | |
| Lead time | According Digikey components delivery time |
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