Customization: | Available |
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Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
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System
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CPU
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Rockchip RK3288,ARM 4Core A17 Up to 1.8GHz
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GPU
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4Core Mali-T764
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RAM
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With Standard 2GB/4GB LPDDR3
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R0M
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With Standard 8GB EMMC,Up to 128GB
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Display
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LVDS
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30pin 2-Way LVDS Interface,Up to1080P
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HD-MI
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HD-MI 2.0 interface,Support up to 4K Output
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MIPI
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31pin FPC MIPI Interface,Up to 1080P
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Audio
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Headphone
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Four-segment 3.5mm headphone jacks, support headphones plugged into speakers to mute
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line out
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Standard left and right channel line output
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MIC
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Differential MIC input
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Amplifier
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8 ohm 6W dual audio amplifier output
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Internet
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Ethernet
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10/100M adaptive Ethernet
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WIFI
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High-performance WiFi,Support 802.11 b/g/n
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Bluetooth
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High-performance BT, support BT V4.0
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4G/3G
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Expand 4G/3G module through external backplane
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I/O Interface
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USB Host
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2 external USB 2.0,7 built in USB 2.0
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USB OTG
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1 external USB2.0 OTG interface
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TF Card
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Self-popping TF card socket, support 128GB
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Serial port
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4-way TTL/RS232 serial
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RTC
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Low power consumption RTC circuit with CR1220 battery
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I2C
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1-way I2C interface
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Backlight
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Backlight control interface, support switch and brightness adjustment
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GPIO
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5-way GPIO Signal
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IR
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IR pin header interface
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Button
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Burn button And power button
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Pilot lamp
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Green working indicator
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Power
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DC input
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12V DC supply, 9V-15V wide voltage input
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Environment
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Working temperature
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-10ºC~70ºC
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Working humidity
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0%~95%(no condensation)
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EMC
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FCC,CE,ROHS
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Operating system
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Android System
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Recommand Android 7.1,Support android 5.1/6.0/8.1
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Linux System
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Ubuntu 18.04,Debian 9,
Buildroot+QT 2018.02 optional |
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Size
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Size
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100mm*80mm
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Thickness
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9mm
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PCB Techinecal Capacity
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Layers
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Mass production: 2~58 layers / Pilot run: 64 layers
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Max. Thickness
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Mass production: 394mil (10mm) / Pilot run: 17.5mm
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Materials
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FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , CAD, Polyimide, BT,PPO, PPE, Hybrid, Partial hybrid, etc |
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Min. Width/Spacing
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Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
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Max. Copper Thickness
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6.0 OZ / Pilot run: 12OZ
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Min. Hole Size
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Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
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Surface Finish
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HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
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Special Process
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Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control |
PCBA technical Capacity
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Advantages
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----Professional Surface-mounting and Through-hole soldering technology
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----Various sizes like 1206,0805,0603 components SMT technology
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----ICT(In Circuit Test),FCT(Functional Circuit Test)
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----PCB Assembly With UL,CE,FCC,Rohs Approval
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----Nitrogen gas reflow soldering technology for SMT.
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----High Standard SMT&Solder Assembly Line
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----High density interconnected board placement technology capacity.
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Components
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Passive Down to 0201 size, BGA and VFBGA, Leadless Chip Carriers/CSP
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Double-sided SMT Assembly, Fine Pitch to 0.8mils, BGA Repair and Reball
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Testing
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Flying Probe Test,X-ray Inspection AOI Test
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SMT
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Position accuracy: 20 um
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Components size: 0.4×0.2mm(01005) -130×79mm, Flip-CHIP, QFP, BGA, POP
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Max. component height: 25mm
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Max. PCB size: 680×500mm
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Min. PCB size: no limited
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PCB thickness: 0.3 to 6mm
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Wave-Solder
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Max. PCB width: 450mm
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Min. PCB width: no limited
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Component height: Top 120mm/Bot 15mm
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Sweat-Solder
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Metal type: part, whole, inlay, sidestep
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Metal material: Copper, Aluminum
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Surface Finish: plating Au, plating sliver, plating Sn
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Air bladder rate: less than 20%
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Press-fit
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Press range: 0-50KN
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Max. PCB size: 800X600mm
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Our products used in various fields such as consumer electronics, industrial control, telecommunication, computer and medical. Wedo not only offer the simple Fr4 PCB but also Alu PCB, Ceramic ALN and AL2O3, metal and copper base PCB, Rigid-flex board, heavycopper and etc.
Shenzhen Yongchangtai Co., Ltd. Was established in Shenzhen city in 2009.
1. who are we?
Pre-Sale and After-Sale Service
1 Hour quotation
2 hours complaint feedback
7*24 hour technical support
7*24 order service
7*24 hour delivery
7*24 production run