Customization: | Available |
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Integrated Graphics: | Integrated Graphics |
Main Chipset: | Rk3588 |
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2. Because the our core board and baseboard are assembled using a two-in-one technology, which allows for individual repair or replacement in case of any issues during use, significantly reducing maintenance costs.
3. Strong technical team support, 24-hour online technical support, 1-on-1 development service.
4. Stable ODM processing service, ensuring a stable qualified rate of 100%, supporting online or on-site factory inspection (factory located in Shenzhen, China, welcome to visit).
5. We have an office in the United States, where staff can visit and communicate at any time, making project progress faster.
RK3588 function and driver support list |
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Android 12.0 kernel 5.10.66 |
Linux Debian |
Linux Buildroot |
Linux Ubuntu 18.04 |
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Hardware Features |
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Dual HDMI 1080P/4K display |
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MIPI display (5.5-inch 720x1280 plus touch assembly) |
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MIPI display (7-inch 1024x600 plus touch assembly) |
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MIPI display (8-inch 800x1280 plus touch assembly) |
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MIPI display (10.1 inch 800x1280 plus touch assembly) |
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MIPI display (10.1 inch 1920x1200 plus touch assembly) |
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LED light (breathing light in the system) |
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RTC (external HYM8563, power-off time preservation) |
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Speaker (the bottom plate can be connected to 5W/8 ohm speaker to play sound) |
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Microphone Input |
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Camera USB interface (binocular or monocular) |
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AP6275 WIFI6 |
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Bluetooth |
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USB3.0 HOST standard A port (3.0U disk/3.0 USB camera) |
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USB HUB X3 |
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USB2.0 HOST standard A port (2.0 USB disk/2.0 USB camera) |
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USB2.0 HOST pin header x 2 (2.0 USB disk/2.0 USB camera) |
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Gigabit Ethernet 0 PCIE |
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Gigabit Ethernet 1 RGMII |
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M2 SSD |
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Debug serial port |
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Serial port 0/2/7/8/(can send and receive data normally) |
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CAN bus |
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RS485 |
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TF card (tested maximum 128G TF card to transfer files to each other) |
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Reset button (system reset function) |
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Upgrade button (long press to enter the flash mode) |
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4G Communications |
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CAN1 receiving and sending |
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RS485 |
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Bus Driver |
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PCIE Driver |
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SPI Driver |
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ADC Driver |
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I2C Driver |
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PWM drive |
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SDIO Driver |
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GPIO Driver |
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USB Driver |
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Software Features |
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.H264 video encoding 1080P 100fps |
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.H264 video decoding 4K 60fps |
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.H265 video encoding 1080P 100fps |
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.H265 video decoding 4K 60fps |
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USB Printer |
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USB Upgrade |
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TF card upgrade |
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OTA Update |
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reset |
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serial number |
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MAC Address |
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Sleep wake-up |
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PCB Techinecal Capacity
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Layers
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Mass production: 2~58 layers / Pilot run: 64 layers
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Max. Thickness
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Mass production: 394mil (10mm) / Pilot run: 17.5mm
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Materials
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FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , CAD, Polyimide, BT,PPO, PPE, Hybrid, Partial hybrid, etc |
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Min. Width/Spacing
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Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
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Max. Copper Thickness
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6.0 OZ / Pilot run: 12OZ
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Min. Hole Size
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Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
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Surface Finish
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HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
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Special Process
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Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control |
PCBA technical Capacity
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Advantages
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----Professional Surface-mounting and Through-hole soldering technology
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----Various sizes like 1206,0805,0603 components SMT technology
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----ICT(In Circuit Test),FCT(Functional Circuit Test)
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----PCB Assembly With UL,CE,FCC,Rohs Approval
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----Nitrogen gas reflow soldering technology for SMT.
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----High Standard SMT&Solder Assembly Line
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----High density interconnected board placement technology capacity.
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Components
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Passive Down to 0201 size, BGA and VFBGA, Leadless Chip Carriers/CSP
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Double-sided SMT Assembly, Fine Pitch to 0.8mils, BGA Repair and Reball
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Testing
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Flying Probe Test,X-ray Inspection AOI Test
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SMT
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Position accuracy: 20 um
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Components size: 0.4×0.2mm(01005) -130×79mm, Flip-CHIP, QFP, BGA, POP
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Max. component height: 25mm
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Max. PCB size: 680×500mm
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Min. PCB size: no limited
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PCB thickness: 0.3 to 6mm
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Wave-Solder
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Max. PCB width: 450mm
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Min. PCB width: no limited
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Component height: Top 120mm/Bot 15mm
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Sweat-Solder
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Metal type: part, whole, inlay, sidestep
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Metal material: Copper, Aluminum
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Surface Finish: plating Au, plating sliver, plating Sn
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Air bladder rate: less than 20%
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Press-fit
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Press range: 0-50KN
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Max. PCB size: 800X600mm
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Our products used in various fields such as consumer electronics, industrial control, telecommunication, computer and medical. Wedo not only offer the simple Fr4 PCB but also Alu PCB, Ceramic ALN and AL2O3, metal and copper base PCB, Rigid-flex board, heavycopper and etc.
Shenzhen Yongchangtai Co., Ltd. Was established in Shenzhen city in 2009.
1. who are we?
Pre-Sale and After-Sale Service
1 Hour quotation
2 hours complaint feedback
7*24 hour technical support
7*24 order service
7*24 hour delivery
7*24 production run