Customization: | Available |
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Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
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CPU
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Rockchip RK3399 (28nm HKMG process)
ARM 6 core 64 bit processor, dual core Cortex-A72 (large core)+quad core Cortex- A53 (small core), main frequency up to 1.8GHz
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GPU
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Mail-T860 GPU MP4 quad core GPU Support OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11 Support AFBC (frame buffer compression)
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Memory
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LPDDR4 2G (Up to 4G)
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built-in storage capacity
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eMMC 16GB (8G/32G/64G/128G optional)
TF Card Extension (can be used to extend SSDs)
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Networking
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Support RJ45 100M network interface and Ethernet
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Support 2.4G WiFi and Wi Fi 802.11b/g/n protocol
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Support 5G dual band WiFi (optional)
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Support Bluetooth function, V2.1+EDR/Bluetooth 3.0/3.0+HS/4.0 (optional)
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Support 4G/5G function and all network communication (optional)
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GPS navigation
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Built in GPS module, sensitivity: - 159dBm, receiving frequency: 1575.42MHz, satellite communication
Channel: 20 channels, positioning accuracy:
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image rotation
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Support 0 degree, 90 degree, 180 degree, 270 degree manual rotation
Support Gravity Sensor Auto Screen Rotation (Optional)
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display interface
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1 * eDP interface (eDP1.3, 4lanes with 10.8Gbps), supporting 3.3V/5V/12V power supply 1 * LVDS interface (single/dual, 6-bit/8-bit), supporting 7 "- 108" display, up to 1080P 60Hz output, supporting 3.3V/5V/12V power supply
1 * HDMI 2.0, support up
to 4K 60Hz output, support HDCP 1.4/2.2
1 * MIPI screen interface, up to 1080P 60Hz output, dual screen differential display
function |
Audio Interface
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1 * Horn output (2 * 18W 4R THD<10%)
1* headset output/input
1* microphone input
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Hardware watchdog
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hardware watchdog support
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touch screen interface
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1 * I 2 C interface (support multi-point resistance touch, multi-point capacitance touch) Support USB multi-point infrared touch, multi-point capacitive touch, multi-point nano film touch, multi-point acoustic touch, multi-point optical touch, etc
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Camera interface
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1 * MIPI camera function, supporting 500W/1300W pixels (optional)
Support 800W-USB interface camera (optional)
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RTC
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Built-in real-time clock power supply battery, support timer on/off
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USB
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supply battery, support timer on/off USB
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PCIe
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1 * Mini PCIe (for 4G module)
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SIM
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1 * SIM card holder, used to expand 4G module with Mini PCIe
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Infrared reception
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1* infrared receiver, support infrared remote control function, support remote control power on
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LED
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1 * power status LED (red), 1 * system LED (blue, flashing by default)
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Pushbutton
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1*Reset button,1*Power button,1*Upgrade button
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Serial port
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4*RS232,2*UART TTL
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IO port
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4 * IO port, supporting input or output Wergen Interface 1* input connector, 1* output connector
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Recommended power adapter
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Input: AC100-240V, 50-60HZ, output: DC12V, 5.5mm/2.1mm DC head
2A-5A (required surge voltage is less than 18V, ripple voltage is less than 100mV)
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PCB Techinecal Capacity
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Layers
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Mass production: 2~58 layers / Pilot run: 64 layers
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Max. Thickness
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Mass production: 394mil (10mm) / Pilot run: 17.5mm
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Materials
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FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , CAD, Polyimide, BT,PPO, PPE, Hybrid, Partial hybrid, etc |
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Min. Width/Spacing
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Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
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Max. Copper Thickness
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6.0 OZ / Pilot run: 12OZ
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Min. Hole Size
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Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
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Surface Finish
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HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
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Special Process
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Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control |
PCBA technical Capacity
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Advantages
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----Professional Surface-mounting and Through-hole soldering technology
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----Various sizes like 1206,0805,0603 components SMT technology
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----ICT(In Circuit Test),FCT(Functional Circuit Test)
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----PCB Assembly With UL,CE,FCC,Rohs Approval
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----Nitrogen gas reflow soldering technology for SMT.
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----High Standard SMT&Solder Assembly Line
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----High density interconnected board placement technology capacity.
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Components
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Passive Down to 0201 size, BGA and VFBGA, Leadless Chip Carriers/CSP
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Double-sided SMT Assembly, Fine Pitch to 0.8mils, BGA Repair and Reball
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Testing
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Flying Probe Test,X-ray Inspection AOI Test
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SMT
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Position accuracy: 20 um
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Components size: 0.4×0.2mm(01005) -130×79mm, Flip-CHIP, QFP, BGA, POP
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Max. component height: 25mm
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Max. PCB size: 680×500mm
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Min. PCB size: no limited
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PCB thickness: 0.3 to 6mm
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Wave-Solder
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Max. PCB width: 450mm
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Min. PCB width: no limited
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Component height: Top 120mm/Bot 15mm
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Sweat-Solder
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Metal type: part, whole, inlay, sidestep
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Metal material: Copper, Aluminum
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Surface Finish: plating Au, plating sliver, plating Sn
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Air bladder rate: less than 20%
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Press-fit
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Press range: 0-50KN
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Max. PCB size: 800X600mm
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Our products used in various fields such as consumer electronics, industrial control, telecommunication, computer and medical. Wedo not only offer the simple Fr4 PCB but also Alu PCB, Ceramic ALN and AL2O3, metal and copper base PCB, Rigid-flex board, heavycopper and etc.
Shenzhen Yongchangtai Co., Ltd. Was established in Shenzhen city in 2009.
1. who are we?
Pre-Sale and After-Sale Service
1 Hour quotation
2 hours complaint feedback
7*24 hour technical support
7*24 order service
7*24 hour delivery
7*24 production run