Rk3399 Development Board Android Linux Single Board for LCD Display

• Type: Rigid Circuit Board
• Dielectric: FR-4
• Material: Synthetic Fiber
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Model NO.: YCT-TM022
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: FR-4
• Transport Package: Carton Box
• Specification: 25*25*10
• Origin: China
• HS Code: 8537109090
• Production Capacity: 50000 PCS / Year

Product Description

RK3399 Development Board Android Linux Single Board for LCD display


Android and Linux Ubuntu OS


- Powerful processing capability, quad-core processor with 2.0GHz main frequency
- Light-loaded AI experience, effectively expanding edge intelligence applications
- Offer high-definition, smooth picture, providing 4K decoding and 1080P encoding
- Gigabit Ethernet port to meet high-speed networking requirements
- Suitable for multiple typical commercial and industrial applications
- Offer multiple industrial protection, including wide temperature operation, wide voltage operation, anti-static and
anti-interference, etc.
- Powerful system compatibility, adapting to a variety of mainstream systems
- Provide SDK to support secondary development

SoM FET3399-C Hardware Features
CPU	RK3399 Cortex-A72 Core: 2x Cortex-A72, frequency up to 1.8GHz, 64-bit ARMv8 Cortex-A53 Core: 4x Cortex-A53, frequency up to 1.4GHz, 64-bit ARMv8
GPU	3D: 4-core Mali-T860MP4 OpenGL ES1.1/ 2.0/ 3.0/ 3.1 OpenCL1.2, OpenVG1.1, DirectX 11.1 2D: Source: ARGB/ RGB888/ RGB565/ RGB4444/ RGB5551/ YUV420/ YUV422(support YUV422SP10bit/ YUV420SP10bit) target form: ARGB/ RGB888/ RGB565/ RGB4444/ RGB5551/ YUV420/ YUV422(support YUV422/ 420 output) Resolution: source: 8192x 8192; target: 4096x 4096
VPU	Decode: H.265/ HEVC, up to 4Kx 2K@ 60FPS VP9, up to 4Kx 2K@ 60FPS H.264/ AVC, up to 4Kx 2K@ 30FPS MPEG-1, ISO/ IEC11172-2, up to 1080P@ 60FPS MPEG-2, ISO/ IEC13818-2, up to 1080P@ 60FPS MPEG-4, ISO/ IEC14496-2, up to 1080P@ 60FPS VC-1, up to 1080P@ 60FPS MVC based on H.264 or H.265, up to 1080P@ 60FPS Encode: 1080P 30AVC/ H.264 1080P 30VP8
RAM	2GB(4GB optional) LPDDR3 1600
Flash	16GB(32GB optional), eMMC5.1, HS400
Working Temp	0ºC to +80ºC
Dimensions	46mm x 70mm
Voltage Input	DC 12V
OS	Android7.1, Linux4.4.189
Display	dual-screen engine up to 4096x 2160 and 2560x 1600, can output from below ports: MIPI-DSI≤ 2 CPU has 3 built-in MIPI PHY, MIPI0 can be only used as DSI, MIPI1 can be used as DSI or CSI, MIPI2 can be only used as CSI each DSI port has 4 data lanes, can support data transferring rate up to 6.0Gbps each DSI port can support output up to 1080P@ 60FPS MIPI0 and MIPI1 combination can support output 2560x 1600@ 60FPS eDP x 1 eDP V1.3 RGB 6/ 8/ 10-bit 4 data lanes, each 2.7/ 1.62Gbps can support PSR DP x 1 Display Port V1.2 compatible with HDCP2.2(backward compatible with HDCP1.3) only has one built-in DP controller, can output from Type-C* support outputting up to 4Kx 2K@ 60Hz HDMI1.4 x 1 HDMI1.4, HDMI2.0 up to 18Gbps port trunks up to 180P@ 120Hz, 4Kx 2K@ 60Hz, QXGA@ 120Hz HDCP1.4/ 2.2
Audio	IIS/ PCM x 3 IIS0/ IIS2 can support 8-lane TX/ RX, IIS1 can support 2-lane TX/ RX IIS2 internally connected to HDMI and DisplayPort, IIS0 and IIS1 are for peripherals audio resolution from 16-bit to 32-bit sampling rate up to 192KHz SPDIF can support two 16-bit audio data storaged in one 32-bit width location can support two-phase formate stereo audio output can support 16-bit to 31-bit audio data left or right justified in 32-bit width sampling data frame zone can support 16-bit, 20-bit, 24-bit audio data transferring in PCM mode can support none-PCM mode
Camera	MIPI CSI≤ 2 can support one 13.0MP camera or two 8.0MP cameras 2 built-in ISP one ISP up to 14.0MP USB UVC can support USB UVC camera input
USB OTG 3.0	USB OTG3.0x 2 (contains USB OTG2.0x 2) Protocol: USB3.0, USB2.0, USB Host 1.1 band width up to 8Gbps in USB3.0 full duplex mode
USB2.0	USB2.0 Host x 2(saperated, not multi-plexed) USB2.0 host can support high speed mode(480Mbps), full-speed mode(12Mbps) and low-speed mode(1.5Mbps)
SD/ MMC	SD/ MMC x 2 can be configured to SD/ MMC or SDIO compliants with SDIO3.0 4-bit data bus width
Ethernet	Gigabit Ethernet port x 1 RGMII can support 10/ 100/ 1000Mbps transferring rate RMII can support 10/ 100Mbps transferring rate
SPI	SPI x 5 serial host and slave modes, software configurable DMA or interrupt based operation TX and RX are both 32x 16-bit FIFO
UART	UART x 5 DMA or interrupt based operations TX and RX are both 64Bytes FIFO each port up to 4.0Mbps
IIC	IIC x 7 multi-host machine IIC standard mode: up to 100Kbit/ s high speed mode: up to 400Kbit/ s
PCIe	PCIe x 1 compliants with PCIe2.1 4 full duplex channels each channel can support 2.5GT/ s serial data transfering rate to each direction dual-operation mode: Root Complex(RC) and End Point(EP)
PWM	PWM x 3 interrupt based operations 32-bit timer/ counter can support capaturing mode can support continuous mode or one-time mode
ADC	ADC x 5 successive approaching ADC 10-bit converting speed up to 1MS/ s sampling rate

OK3399-C Carrier board Features
Power Input	DC12V
HDMI1.4	HDMI1.4, HDMI2.0, up to 18Gbps port trunks
USB Type-C	flash OS image or update system by USB Type-C compliants with USB Type-C 1.1 can support USB3.0 Type-C and DP1.2* to switch to USB Type-C mode USB3.0 data reate up to 5Gbps DP1.2 transferring rate up to 5.4Gbps(HBR2), can support 1/ 2/ 4 mode* can support DisplayPort AUX channel*
TF Card	can support flash OS image or update system image by TF card can support 1.8V* mode and 3.3V mode
USB3.0	protocols: USB3.0, USB2.0, USB Host1.1 band width up to 8Gbps in USB3.0 full duplex mode
USB2.0	USB Host2.0 x 4 USB2.0 Host Type-A x 2 expanded by USB HUB, it shares one HUB with 4G and P28 USB2.0 Host XH2.54 x 2 P29 is a native USB P28 is used for USB HUB
IO Expanding	SPI x 2 serial host and slave modes are software configurable Operation based on DMA or interrupt TX and RX are 32x 16-bit FIFO UART x 1 it's configured to GPS in Android system multiplexed with SPI1 IIC x 1 multi-host IIC standard mode: up to 100Kbit/s high speed mode: up to 400Kbit/s ADC x 2 successive approaching ADC 10-bit converting speed up to 1MS/s sampling rate GPIO x 4 1.8V
4G	Mini PCIe
Debug	Micro USB connector on-board USB to serial chip(CP2102)
Ethernet	10/ 100/ 1000Mbps auto-negotiable, RJ45 connector
Camera	MIPI CSI x 2 can support one 13.oMP camera or two 8.0MP cameras
VoL	it's used as audio volume ajusting function in Android system VoL+ is a key for Recover, pressing this key to get into OTG flashing mode
3.5mm Earphone	can support MIC and Headphone compliants with CTIA, supports earphone headset
Speaker	output consumption up to 1W can support D amplifier
WIFI& BT	WIFI IEEE802.11b/ b/ n & WIFI AP 2.4GHz IEEE802.11a/ n/ ac & WIFI AP 5GHz SDIO3.0@ WIFI BT BT5.0 UART/ PCM@ BT can support host and slave modes
eDP	eDP V1.3 can support 4 data lanes, each up to 2.7/ 1.62Gbps for 12V power supply, backlight enabled and PWM brightness adjusting
MIPI-DSI	4 data lanes, data transferring rate up to 6.0Gbps can support up to 1080P@ 60FPS outputing
M.2	PCIe x 4, full duplxe each channal data transferring rate up to 2.5GT/s to each direction connector: M.2 KEY M preserved with 2260 and 2280 holes for M.2 device can support NVMe disk

 

PCB Techinecal Capacity
Layers		Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness		Mass production: 394mil (10mm) / Pilot run: 17.5mm
Materials		FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , CAD, Polyimide, BT,PPO, PPE, Hybrid, Partial hybrid, etc
Min. Width/Spacing		Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness		6.0 OZ / Pilot run: 12OZ
Min. Hole Size		Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Surface Finish		HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process		Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control

 
 

Product Description

 

PCBA technical Capacity
Advantages		----Professional Surface-mounting and Through-hole soldering technology
		----Various sizes like 1206,0805,0603 components SMT technology
		----ICT(In Circuit Test),FCT(Functional Circuit Test)
		----PCB Assembly With UL,CE,FCC,Rohs Approval
		----Nitrogen gas reflow soldering technology for SMT.
		----High Standard SMT&Solder Assembly Line
		----High density interconnected board placement technology capacity.
Components		Passive Down to 0201 size, BGA and VFBGA, Leadless Chip Carriers/CSP
		Double-sided SMT Assembly, Fine Pitch to 0.8mils, BGA Repair and Reball
Testing		Flying Probe Test,X-ray Inspection AOI Test
SMT		Position accuracy: 20 um
		Components size: 0.4×0.2mm(01005) -130×79mm, Flip-CHIP, QFP, BGA, POP
		Max. component height: 25mm
		Max. PCB size: 680×500mm
		Min. PCB size: no limited
		PCB thickness: 0.3 to 6mm
Wave-Solder		Max. PCB width: 450mm
		Min. PCB width: no limited
		Component height: Top 120mm/Bot 15mm
Sweat-Solder		Metal type: part, whole, inlay, sidestep
		Metal material: Copper, Aluminum
		Surface Finish: plating Au, plating sliver, plating Sn
		Air bladder rate: less than 20%
Press-fit		Press range: 0-50KN
		Max. PCB size: 800X600mm

Our Advantages

Our products used in various fields such as consumer electronics, industrial control, telecommunication, computer and medical. Wedo not only offer the simple Fr4 PCB but also Alu PCB, Ceramic ALN and AL2O3, metal and copper base PCB, Rigid-flex board, heavycopper and etc.

Company Profile

Shenzhen Yongchangtai Co., Ltd. Was established in Shenzhen city in 2009.

Yongchangtai has been a large-scale comprehensive research and development manufacturing enterprise in the field of electronic products, almost covering all kinds of home appliance controllers, device controllers, home intelligent controllers, lighting products, new energy products, etc. Yongchangtai business has extended to OSRAM in China,as well Europe, USA and Southeast Asia. Main customers were many domestic and foreign well-known included EUPA, TCL, Huawei and so on. Yongchangtai is a professional manufacturer of PCBs, which are widely applicable to consumer electronics, telecommunication products, medical equipment and prototypes.We offer one-stop service for hardware and schematic design, board layout, component selection, firmware design, and mechanical design to PCBA and chip cloning. We can also help you procure components as well as provide PCB FPC and mold making, plastic injection, assembly, packaging and shipment services. In addition, our raw material and key components are sourced from famous suppliers such as Sharp, Toshiba, ST, Samsung, Infineon, Ti,ON,Microchip and so on. Our Facilities and Workforce We have 3,000 square meters workshop with 360 workers. The equipment includes Panasonic CM402,DT401,DT301.Three high speed auto SMT lines.Our 12 R&D engineers with over 10 years of experience worked in FOXCONN, Flextronics , Huawei, HP. They develop new items to update our catalog monthly. Moreover, we have 20 QC auditors with three years of experience who use advanced testing equipment such as AOI, BGA X-ray and PCB E-test to ensure all our products comply with IECQ-HSPM QC 080000, CE, UL and RoHS certifications.
 

Certifications

 

 

FAQ

 

1. who are we?
We are based in Guangdong, China, start from 2009,sell to Northern Europe(15.00%),Eastern Europe(15.00%),Africa(15.00%),North America(15.00%),Western Europe(10.00%),South America(10.00%),South Asia(5.00%),Southeast Asia(5.00%),Domestic Market(2.00%),Eastern Asia(2.00%),Mid East(2.00%),Central America(2.00%),Oceania(2.00%). There are total about 301-500 people in our office.

2. how can we guarantee quality?
Always a pre-production sample before mass production;
Always final Inspection before shipment;

3.what can you buy from us?
PCBA,PCB Assembly,printed circuit board assembly,electronic circuit board,electronic boards

4. why should you buy from us not from other suppliers?
Advanced equipments, high skilled sales and manufacturing teams, excellent quality,over 10 years' focus on electronic components,manufacturing and full assembly, our customers such as Faurecia,Midea, etc.

5. what services can we provide?
Accepted Delivery Terms: FOB,CFR,CIF,EXW,CPT,DDU,Express Delivery;
Accepted Payment Currency:USD,HKD,CNY;
Accepted Payment Type: T/T,Credit Card,PayPal,Western Union;
Language Spoken:English,Chinese

After Sales Service

Pre-Sale and After-Sale Service
1 Hour quotation
2 hours complaint feedback
7*24 hour technical support
7*24 order service
7*24 hour delivery
7*24 production run

 

About US

1. 15 years experience in PCBA
2. Strong R&D team over 70 people
3. Factory passed ISO9001 quality system certification
4. Big workshop area of over 3500 square meters with more than 200 employees.
5. Have a senior R&D team, with hardware engineers, software engineers, product engineers and so on, can undertake all kinds of OEM/ODM orders processing and production;
6. One-stop production of the factory, from PCB patch. Plug-in. Test. Assembly. Packaging and shipment are completed in this factory, reducing the flow of intermediate links;
7.We can support drop-shipping for 1pcs, welcome to order, and welcome to visit the factory.