| Task: | Program |
|---|---|
| Structure: | Combination |
| Mathematical Model: | Linear |
PCB custom capacity
| Item | Mass Production | Pilot Run Production |
| Capacity | Capacity | |
| Layer Counts | 1L-18L, HDI | 20-28 , HDI |
| Material | CEM1,CEM3,FR-4, High TG FR4 , Halogen-free FR4 , aluminium ,Ceramic(96% Alumina) | |
| PTFE(F4B,F4BK), Rogers(4003,4350,5880)Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc. | ||
| Material Mixed Laminate | 4 layers -- 10 layers | 12 layers |
| FR4+Ro4350 , FR4+Aluminium , FR4+ Polyimide | ||
| Maximum Size | 610mm X 1200mm | 1200 - 2000MM |
| Board Outline Tolerance | ±0.15mm | ±0.10mm |
| Board Thickness | 0.125mm--6.00mm | 0.1mm--8.00mm |
| Thickness Tolerance ( t≥0.8mm) | ± 8% | ±5% |
| Thickness Tolerance( t<0.8mm) | ±10% | ±8% |
| Minimum Line / Space | 0.10mm | 0.075mm |
| Trace width Tolerance | 15%-20% | 10% |
| Minimum Drilling Hole (Mechanical) | 0.2mm | 0.15mm |
| Minimum laser hole | 0.1mm | 0.075mm |
| Hole Position/hole Tolerance | ±0.05mm PTH:±0.076MM NPTH:±0.05mm | |
| Mini hole ring (single | 0.075MM | 0.05MM |
| OutLayer Copper Thickness | 17um--175um | 175um--210um |
| InnerLayer Copper Thickness | 17um--175um | 175um--210um |
| Mini Solder Mask Bridge | 0.05mm | 0.025mm |
| Impedance Control Tolerance | ±10% | ±5% |
| Surface Finishing | HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver. | |
| Plated gold , OSP, Carbon ink, | ||
| Acceptable File Format | ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc. | |
| Quality Standards | IPC-A-600F and MIL-STD-105D CHINA GB<4588> | |
PCBA custom Capacity
|
Stencil Size |
736x736mm |
| Minimum IC Pitch | 0.2mm |
| Maximum PCB size | 510X460mm |
| Minimum PCB thickness | 0.5mm |
| Minimum chip size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
| Maximum BGA size: | 74x74mm |
| BGA ball pitch: | 1.00mm (minimum), 3.00mm (maximum) |
| BGA ball diameter: | 0.40mm (minimum), 1.00mm (maximum) |
| QFP lead pitch: | 0.38mm (minimum), 2.54mm (maximum) |
| Machine Type | Panasnic CM 402 |
| Panasnic DT301 | |
| Panasnic CM 402 | patch speed:0.06sec/ chip (up to 60,000cph) |
| Patch precision:±0.03~±0.005mm | |
| PCB size:max:510X460mm,min:50X50mm | |
| element size: 0603mm-50X50mm | |
| Panasnic DT301 | patch speed:0.7sec/ chip |
| Patch precision:±0.03~±0.005mm | |
| PCB size:max:510X460mm,min:50X50mm | |
| element size: 1005mm-100X90mmX25mm high speed multifunctional mounter | |
| Volume: | One piece to low volume production quantities |
| Low cost first prototype Fab | |
| Fast deliveries | |
| Assembly type: | SMT assembly |
| DIP assembly | |
| Mixed(surface mount and through hole) technology | |
| Cable assembly | |
| Components type: | Passive components |
| As small as 0402 package | |
| As small as 0201 with design review | |
| Ball Grid Arrays(BGA): | |
| As small as .5mm pitch | |
| Component source | Shar,poshiba, ST, |
| Samsng, Infineon, Ti, | |
| ON,Microchip etc. | |
| Parts procurements: | provide one-stop services |
| Only Assembly service (you supply the parts) | |
| You supply some parts(expensive/important components), we do the rest | |
| Solder type: | Leaded |
| Lead-free/ROHS compliant | |
| Other capabilities: | Repair/rework services |
| Mechanical assembly | |
| Box build | |
| Mold and plastic injection. | |
| Testing Type | First prototype test before mass quantity production |
| AOI | |
| BGA X-ray | |
| PCB E-test | |
| Lead time | According Digikey components delivery time |
