High Quality Supplier Customized Mobile Phone Motherboard PCBA Design ODM OEM Copper PCB PCBA One Stop Service

• Metal Coating: Copper
• Mode of Production: SMT
• Layers: Multilayer
• Certification: RoHS, ISO
• Customized: Customized
• Condition: New
• Model NO.: YCTBJ-091
• Transport Package: Bubble Anti-Static Bag
• Specification: Custom
• Trademark: YCT
• Origin: China
• HS Code: 8534009000
• Production Capacity: 100000piece/Year

Product Description

PCBA Custom Case


Custom Production Capacity

PCB custom capacity

Item	Mass Production	Pilot Run Production
	Capacity	Capacity
Layer Counts	1L-18L, HDI	20-28 , HDI
Material	CEM1,CEM3,FR-4, High TG FR4 , Halogen-free FR4 , aluminium ,Ceramic(96% Alumina)
	PTFE(F4B,F4BK), Rogers(4003,4350,5880)Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc.
Material Mixed Laminate	4 layers -- 10 layers	12 layers
	FR4+Ro4350 , FR4+Aluminium , FR4+ Polyimide
Maximum Size	610mm X 1200mm	1200 - 2000MM
Board Outline Tolerance	±0.15mm	±0.10mm
Board Thickness	0.125mm--6.00mm	0.1mm--8.00mm
Thickness Tolerance ( t≥0.8mm)	± 8%	±5%
Thickness Tolerance( t<0.8mm)	±10%	±8%
Minimum Line / Space	0.10mm	0.075mm
Trace width Tolerance	15%-20%	10%
Minimum Drilling Hole (Mechanical)	0.2mm	0.15mm
Minimum laser hole	0.1mm	0.075mm
Hole Position/hole Tolerance	±0.05mm           PTH:±0.076MM     NPTH:±0.05mm
Mini hole ring (single	0.075MM	0.05MM
OutLayer Copper Thickness	17um--175um	175um--210um
InnerLayer Copper Thickness	17um--175um	175um--210um
Mini Solder Mask Bridge	0.05mm	0.025mm
Impedance Control Tolerance	±10%	±5%
Surface Finishing	HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver.
	Plated gold , OSP, Carbon ink,
Acceptable File Format	ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc.
Quality Standards	IPC-A-600F and MIL-STD-105D CHINA GB<4588>

 

PCBA custom Capacity

Stencil Size	736x736mm
Minimum IC Pitch	0.2mm
Maximum PCB size	510X460mm
Minimum PCB thickness	0.5mm
Minimum chip size:	0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size:	74x74mm
BGA ball pitch:	1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter:	0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch:	0.38mm (minimum), 2.54mm (maximum)
Machine Type	Panasonic CM 402
	Panasonic DT301
Panasonic CM 402	patch speed:0.06sec/ chip (up to 60,000cph)
	Patch precision:±0.03~±0.005mm
	PCB size:max:510X460mm,min:50X50mm
	element size: 0603mm-50X50mm
Panasonic DT301	patch speed:0.7sec/ chip
	Patch precision:±0.03~±0.005mm
	PCB size:max:510X460mm,min:50X50mm
	element size: 1005mm-100X90mmX25mm  high speed multifunctional mounter
Volume:	One piece to low volume production quantities
	Low cost first prototype Fab
	Fast deliveries
Assembly type:	SMT assembly
	DIP assembly
	Mixed(surface mount and through hole) technology
	Cable assembly
Components type:	Passive components
	As small as 0402 package
	As small as 0201 with design review
	Ball Grid Arrays(BGA):
	As small as .5mm pitch
Component source	Shar,poshiba, ST,
	Samsung, Infineon, Ti,
	ON,Microchip etc.
Parts procurements:	provide one-stop services
	Only Assembly service (you supply the parts)
	You supply some parts(expensive/important components), we do the rest
Solder type:	Leaded
	Lead-free/ROHS compliant
Other capabilities:	Repair/rework services
	Mechanical assembly
	Box build
	Mold and plastic injection.
Testing Type	First prototype test before mass quantity production
	AOI
	BGA X-ray
	PCB E-test
Lead time	According Digikey components delivery time

Packaging
Strong pac kaging, not easily to be damaged or deformed during the long-distance transportation.


Contact

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