18650 Battery Boost Module 5V/12V Charging and Discharging Router UPS Uninterrupted Protection Integrated Charging Board

• Transport Package: Bubble Anti-Static Bag
• Specification: Custom
• Trademark: YCT
• Origin: China
• Model NO.: YCTBJ-235
• HS Code: 8534009000
• Production Capacity: 100000piece/Year

Product Description

Main functions
1) Lithium battery charging
2) Lithium battery protection (short circuit, overvoltage, undervoltage)
3) Boost output 5v/9v/12v optional
4) Equipped with universal TYPE-C charging interface, direct DC5V input to charge lithium battery
5) Two-color LED indicator, red light is always on during charging, green light is always on when full, and charging stops automatically
6) UPS power failure uninterruptible power supply function principle
When the power is connected, the power supply directly supplies power to the load through the boost circuit. Once the power is cut off, the battery is automatically started to supply power to the load through the boost circuit. After the power is restored, the power supply is restored to the load and the battery is also charged
7) Interface description (refer to the figure above): TYPE-C port and standard input 5V+, 5V- are external power supply ports, and one of the two can be selected.

Input: DC5V  Output: 5V/9V/12V optional
When output voltage 5V: current limit is 1000mA
When output voltage 9V: current limit is 500mA
When output voltage 12V: current limit is 350mA

Note: charging power supply current should be greater than output current.
Load power: UPS output +- connected to load, normal recommended <5W, transient <8W



We also offer the customization of all kinds of wiring harness.
• We offer the production and assembling of various electronic cables and communication cables.
• In the aspects of opening, crimping, pre- assembly, and final assembly, we would use verified materials and professional automation equipment.
• To realize the whole process control of quality, we would use the wiring harness detector to test the first piece.




Besides, we also provide the PCBA/ PCB one-stop custom services/ PCBA Custom service.


Custom Production Capacity

PCB custom capacity

Item	Mass Production	Pilot Run Production
	Capacity	Capacity
Layer Counts	1L-18L, HDI	20-28 , HDI
Material	CEM1,CEM3,FR-4, High TG FR4 , Halogen-free FR4 , aluminium ,Ceramic(96% Alumina)
	PTFE(F4B,F4BK), Rogers(4003,4350,5880)Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc.
Material Mixed Laminate	4 layers -- 10 layers	12 layers
	FR4+Ro4350 , FR4+Aluminium , FR4+ Polyimide
Maximum Size	610mm X 1200mm	1200 - 2000MM
Board Outline Tolerance	±0.15mm	±0.10mm
Board Thickness	0.125mm--6.00mm	0.1mm--8.00mm
Thickness Tolerance ( t≥0.8mm)	± 8%	±5%
Thickness Tolerance( t<0.8mm)	±10%	±8%
Minimum Line / Space	0.10mm	0.075mm
Trace width Tolerance	15%-20%	10%
Minimum Drilling Hole (Mechanical)	0.2mm	0.15mm
Minimum laser hole	0.1mm	0.075mm
Hole Position/hole Tolerance	±0.05mm           PTH:±0.076MM     NPTH:±0.05mm
Mini hole ring (single	0.075MM	0.05MM
OutLayer Copper Thickness	17um--175um	175um--210um
InnerLayer Copper Thickness	17um--175um	175um--210um
Mini Solder Mask Bridge	0.05mm	0.025mm
Impedance Control Tolerance	±10%	±5%
Surface Finishing	HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver.
	Plated gold , OSP, Carbon ink,
Acceptable File Format	ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc.
Quality Standards	IPC-A-600F and MIL-STD-105D CHINA GB<4588>

 

PCBA custom Capacity

Stencil Size	736x736mm
Minimum IC Pitch	0.2mm
Maximum PCB size	510X460mm
Minimum PCB thickness	0.5mm
Minimum chip size:	0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size:	74x74mm
BGA ball pitch:	1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter:	0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch:	0.38mm (minimum), 2.54mm (maximum)
Machine Type	Panasnic CM 402
	Panasnic DT301
Panasnic CM 402	patch speed:0.06sec/ chip (up to 60,000cph)
	Patch precision:±0.03~±0.005mm
	PCB size:max:510X460mm,min:50X50mm
	element size: 0603mm-50X50mm
Panasnic DT301	patch speed:0.7sec/ chip
	Patch precision:±0.03~±0.005mm
	PCB size:max:510X460mm,min:50X50mm
	element size: 1005mm-100X90mmX25mm  high speed multifunctional mounter
Volume:	One piece to low volume production quantities
	Low cost first prototype Fab
	Fast deliveries
Assembly type:	SMT assembly
	DIP assembly
	Mixed(surface mount and through hole) technology
	Cable assembly
Components type:	Passive components
	As small as 0402 package
	As small as 0201 with design review
	Ball Grid Arrays(BGA):
	As small as .5mm pitch
Component source	Shar,poshiba, ST,
	Samsng, Infineon, Ti,
	ON,Microchip etc.
Parts procurements:	provide one-stop services
	Only Assembly service (you supply the parts)
	You supply some parts(expensive/important components), we do the rest
Solder type:	Leaded
	Lead-free/ROHS compliant
Other capabilities:	Repair/rework services
	Mechanical assembly
	Box build
	Mold and plastic injection.
Testing Type	First prototype test before mass quantity production
	AOI
	BGA X-ray
	PCB E-test
Lead time	According Digikey components delivery time

Packaging
Strong pac kaging, not easily to be damaged or deformed during the long-distance transportation.


Contact

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