Customization: | Available |
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Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
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Specifications:
1.Application battery voltage: 3.2V lithium iron phosphate battery / 3.7V lithium battery.
This circuit board does not have over-charge and over-discharge protection. The battery needs a protection circuit to prevent over-charge and over-discharge.
2. Application LED voltage: 2.8V-3.3V. Power <10w
3. Application of solar panel power: 5V-6V / <10W
4. Induction mode: light-controlled induction + Radar body induction
5. Induction distance: 5-10M
6. Induction time: high light for about 15 seconds+low light for long light/off
Batteries are not installed in the remote control equipped with this control panel. Batteries need to be purchased at local stores.
The surface of the patch part is an inductive launching surface. It is not allowed to stick adhesive and glue. Otherwise, the induction distance will be shortened.
The surface of the patch parts should not be covered by metal.
Otherwise, the sensing distance will be less or shorter.
The induction surface can penetrate glass or plastic.
PCB Techinecal Capacity
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Layers
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Mass production: 2~58 layers / Pilot run: 64 layers
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Max. Thickness
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Mass production: 394mil (10mm) / Pilot run: 17.5mm
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Materials
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FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , CAD, Polyimide, BT,PPO, PPE, Hybrid, Partial hybrid, etc |
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Min. Width/Spacing
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Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
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Max. Copper Thickness
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6.0 OZ / Pilot run: 12OZ
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Min. Hole Size
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Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
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Surface Finish
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HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
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Special Process
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Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control |
PCBA technical Capacity
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Advantages
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----Professional Surface-mounting and Through-hole soldering technology
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----Various sizes like 1206,0805,0603 components SMT technology
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----ICT(In Circuit Test),FCT(Functional Circuit Test)
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----PCB Assembly With UL,CE,FCC,Rohs Approval
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----Nitrogen gas reflow soldering technology for SMT.
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----High Standard SMT&Solder Assembly Line
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----High density interconnected board placement technology capacity.
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Components
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Passive Down to 0201 size, BGA and VFBGA, Leadless Chip Carriers/CSP
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Double-sided SMT Assembly, Fine Pitch to 0.8mils, BGA Repair and Reball
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Testing
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Flying Probe Test,X-ray Inspection AOI Test
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SMT
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Position accuracy: 20 um
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Components size: 0.4×0.2mm(01005) -130×79mm, Flip-CHIP, QFP, BGA, POP
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Max. component height: 25mm
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Max. PCB size: 680×500mm
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Min. PCB size: no limited
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PCB thickness: 0.3 to 6mm
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Wave-Solder
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Max. PCB width: 450mm
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Min. PCB width: no limited
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Component height: Top 120mm/Bot 15mm
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Sweat-Solder
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Metal type: part, whole, inlay, sidestep
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Metal material: Copper, Aluminum
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Surface Finish: plating Au, plating sliver, plating Sn
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Air bladder rate: less than 20%
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Press-fit
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Press range: 0-50KN
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Max. PCB size: 800X600mm
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Our products used in various fields such as consumer electronics, industrial control, telecommunication, computer and medical. Wedo not only offer the simple Fr4 PCB but also Alu PCB, Ceramic ALN and AL2O3, metal and copper base PCB, Rigid-flex board, heavycopper and etc.
Shenzhen Yongchangtai Co., Ltd. Was established in Shenzhen city in 2009.
1. who are we?
Pre-Sale and After-Sale Service
1 Hour quotation
2 hours complaint feedback
7*24 hour technical support
7*24 order service
7*24 hour delivery
7*24 production run